Design, Invent & Innovate (DII) Summer Program

Computer ScienceMechanical Engineering

The Design, Invent & Innovate (DII) summer program teaches rising 9th through 12th-grade students fundamental principles of innovation in science and engineering. Participants engage in hands-on projects, utilizing rapid prototyping tools and computer-aided design (CAD) to identify problems and build solutions at NYU Tandon's Makerspace.

Program details

Deadline: Apr 17, 2027
Dates: Jun 15, 2027 – Jun 27, 2027
Grade level: Grades 9–12
Location: NYU Tandon School of Engineering, Brooklyn, NY
Program type: Summer program
Duration: 2 weeks
Attendance: Residential

Eligibility

Must be a rising 9th-12th grade high school student. Housing requires participants to be at least 15 years old.

Costs and support

Cost: $3,230 (Tuition, materials, events, fees). Additional $654 for optional housing.
Financial aid: Not specified
Stipend: Not specified

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