Back to Opportunities
Design, Invent & Innovate (DII) Summer Program
Computer ScienceMechanical Engineering
Design, Invent & Innovate (DII) is a summer program for rising 9th-12th grade students that teaches principles of innovation in science and engineering. Participants learn to use rapid prototyping tools and CAD modeling, conduct field research, and design and build solutions at NYU Tandon's Makerspace.
Program details
- Deadline
- Apr 17, 2026
- Dates
- Jun 15, 2026 – Jun 27, 2026
- Grade level
- Grades 9–12
- Program type
- Summer program
- Duration
- 2 weeks
- Attendance
- Residential
Eligibility
Rising 9th through 12th-grade high school students. Housing requires students to be at least 15 years old.
Costs and support
- Cost
- $3,230 (Tuition, materials, events, fees). Housing is an additional $654.00, optional.
- Financial aid
- Not specified
- Stipend
- Not specified
Student projects
No student projects are linked to this opportunity yet.
See something out of date?
Tell us so we can review and update this opportunity.
Report an update